Ethylene glycol-based Ag plating for the wet chemical fabrication of one micrometer Cu/Ag core/shell particles
Author:
Funder
Ministry of Trade, Industry & Energy
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference14 articles.
1. Fabrication of Cu–Ag core–shell bimetallic superfine powders by eco-friendly reagents and structures characterization
2. Direct writing of copper conductive patterns by ink-jet printing
3. Developing process for coating copper particles with silver by electroless plating method
4. Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives
5. Graphene-stabilized copper nanoparticles as an air-stable substitute for silver and gold in low-cost ink-jet printable electronics
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