Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints

Published:2008-06 Issue:1-2 Volume:458 Page:253-260
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Kim Dae-Gon,Kim Jong-Woong,Ha Sang-Su,Noh Bo-In,Koo Ja-Myeong,Park Dong-Woon,Ko Myung-Wan,Jung Seung-Boo

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference14 articles.

1. Long time reliability study of soldered flip chips on flexible substrates

2. Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure

3. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

4. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization

5. Design for lead‐free solder joint reliability of high‐density packages

Cited by 24 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components;Metals;2024-08-29

2. Contrastive Study on Multiple Reflowing in SnAg-Cu/Ni-P Joints by Laser and Reflow Soldering;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Thermomechanical reliability of a Cu/Sn-3.5Ag solder joint with a Ni insertion layer in flip chip bonding for 3D interconnection;Journal of Materials Science: Materials in Electronics;2021-04-19

4. Mechanical reliability of self-aligned chip assembly after reflow soldering process;Soldering & Surface Mount Technology;2020-04-28

5. Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film;Vacuum;2019-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3