Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. In situ investigation of SnAgCu solder alloy microstructure
2. Effect of liquid–liquid structure transition on solidification and wettability of Sn–0.7Cu solder
3. Effect of phosphorus element on the comprehensive properties of Sn–Cu lead-free solder
4. Effect of adding 0.3wt% Ni into the Sn–0.7wt% Cu solder
5. Stabilisation of Cu6Sn5 by Ni in Sn-0.7Cu-0.05Ni lead-free solder alloys
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4. Improved microstructure and mechanical properties for sintered NdFeB permanent magnet/steel soldered joints by Nd addition;Journal of Manufacturing Processes;2021-04
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