Application of constitutive description and integrated ANFIS – ICA analysis to predict hot deformation behavior of Sn-5Sb lead-free solder alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference44 articles.
1. Indentation creep of lead-free Sn–3.5Ag solder alloy: effects of cooling rate and Zn/Sb addition;Mahmudi;Mater. Sci. Eng. A,2013
2. Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi;Karaköse;J. Alloys Compd.,2016
3. Room-temperature indentation creep of lead-free Sn-5%Sb solder alloy;Geranmayeh;J. Electron. Mater.,2005
4. Effect of cooling rate on the room-temperature indentation creep of cast lead-free Sn–Bi solder alloys;Mahmudi;Phys. Status Solidi (a),2007
5. High-temperature shear strength of lead-free Sn–Sb–Ag/Al2O3 composite solder;Geranmayeh;Mater. Sci. Eng. A,2011
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