Microstructural evolution of Sn–9Zn–3Bi solder/Cu joint during long-term aging at 170°C
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference16 articles.
1. Lead-free Solders in Microelectronics
2. The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements
3. Heat Resistance of Sn–9Zn Solder/Cu Interface with or without Coating
4. Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys
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1. Solid/Solid State Interfacial Reactions in the Sn-9Zn/Cu-Based Alloys (C1990 HP, Alloy 25, and C194) Couples;JOM;2023-04-25
2. Investigation and Comparison of Aging Effects in SAC+Bi Solders Exposed to High Temperatures;2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2021-06-01
3. Electrochemical Corrosion of SAC Alloys: A Review;Metals;2020-09-23
4. Investigation and Comparison of Aging Effects in SAC+X Solders Exposed to High Temperatures;2020 IEEE 70th Electronic Components and Technology Conference (ECTC);2020-06
5. On the mechanism of Sn tunnelling induced intermetallic formation between Sn-8Zn-3Bi solder alloys and Cu substrates;Journal of Alloys and Compounds;2019-06
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