Author:
Chen Chih-ming,Hung Yu-min,Lin Ching-hsuan
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. S. Brandenburg, S. Yeh, Proceedings of the Surface Mount International Conference and Exhibition, SMI 98, San Jose, CA, August 23–27, 1998 (SMTA, Edina, MN), p. 337.
2. Electromigration-induced UBM consumption and the resulting failure mechanisms in flip-chip solder joints
3. Diffusion in Solids: Recent Developments;Huntington,1975
4. Current-crowding-induced electromigration failure in flip chip solder joints
5. Electromigration failure in flip chip solder joints due to rapid dissolution of copper
Cited by
17 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献