Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference29 articles.
1. Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
2. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
3. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
4. Interfacial stability of eutectic SnPb solder and composite 60Pb40Sn solder on Cu/Ni(V)/Ti under-bump metallization
5. Dissolution kinetics of BGA Sn–Pb and Sn–Ag solders with Cu substrates during reflow
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