Kinetics of indium and indium–tin soldering materials in vacuum volatilization-Reference-Cited by-同舟云学术

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Kinetics of indium and indium–tin soldering materials in vacuum volatilization

Published:2023-11 Issue: Volume:27 Page:6799-6810
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Pang Jian,Kong Lingxin^ORCID,Yang Bin,Yang Zhicheng,Wu Hai,Zhao Wei,Zhang Jiapeng,Xu Junjie,Xu Baoqiang

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference53 articles.

1. Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties;Zhong;Mater Des,2022

2. Reliability of automotive and consumer MEMS sensors - an overview;Hommel;Microelectron Reliab,2021

3. Effects of system design on fatigue life of solder joints in BGA packages under vibration at random Frequencies;Samavatian;J Electron Mater,2018

4. Properties of solders with low melting point;Chriašteľová;J Alloys Compd,2008

5. Wetting behavior and mechanical properties of Sn-Zn and Sn-Pb solder alloys;Garcia;J Electron Mater,2009

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Exploring arsenic removal behavior in purification process of antimony metal through vacuum volatilization;Separation and Purification Technology;2024-12

2. Deep removal of Sn, Pb, and Sb in refined indium by vacuum distillation;Separation and Purification Technology;2024-09

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