Interfacial reaction between Sn1Ag0.5Cu(Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Effects of Ag content on fracture resistance of Sn–Ag–Cu lead-free solders under high-strain rate conditions
2. Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
3. High-G drop impact response and failure analysis of a chip packaged printed circuit board
4. High temperature aging study of intermetallic compound formation of Sn–3.5Ag and Sn–4.0Ag–0.5Cu solders on electroless Ni(P) metallization
5. IMC morphology, interfacial reaction and joint reliability of Pb-free Sn–Ag–Cu solder on electrolytic Ni BGA substrate
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1. Effect of co on the morphology and mechanical properties of the Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joints on ENEPIG surface;Materials Characterization;2024-03
2. Thermal, Microstructural, and Mechanical Features of Bi-Containing Sn-1Ag-0.5Cu Lead-Free Solders;Journal of Electronic Materials;2023-04-27
3. Advanced Memory and Device Packaging;Springer Series in Reliability Engineering;2023
4. A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials;Journal of Materials Science: Materials in Electronics;2021-10-05
5. Role of Ni impurities in solid-state diffusion of intermetallic compounds in the Sn-0.7Cu-10Bi-xNi/Ni interface reaction;Materials Research Express;2019-10-11
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