Creep behavior of eutectic 80Au/20Sn solder alloy
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference24 articles.
1. High-power operation of highly reliable narrow stripe pseudomorphic single quantum well lasers emitting at 980 nm
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3. Mounting of high power laser diodes on boron nitride heat sinks using an optimized Au/Sn metallurgy
4. High-power and low-divergence 980-nm InGaAs-GaAsP-AlGaAs strain-compensated quantum-well diode laser grown by MOCVD
5. High-Power InAlGaAs/GaAs and AlGaAs/GaAs Semiconductor Laser Arrays Emitting at 808 nm
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1. A study on the thermomechanical response of various die attach metallic materials of power electronics;Soldering & Surface Mount Technology;2024-05-09
2. Research on the creep response of lead-free die attachments in power electronics;International Journal of Structural Integrity;2024-05-07
3. Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials;Journal of Electronic Packaging;2024-03-13
4. Overcoming strength-toughness trade-off in a eutectic high entropy alloy by optimizing chemical and microstructural heterogeneities;Communications Materials;2024-02-03
5. Thermomechanical Stresses in Silicon Chips for Optoelectronic Devices;Applied Sciences;2023-02-20
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