Effects of small addition of In on the structure of the rapidly cooled Sn–Ag–Zn solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference17 articles.
1. Lead-free Solders in Microelectronics
2. Proceedings of the Fifth Symposium on Microjointing and Assembly Technology in Electronics;Hirano,1999
3. Solid-state reactions between Ni and Sn–Ag–Cu solders with different Cu concentrations
4. Reactions between Sn–Ag–Cu lead‐free solders and the Au/Ni surface finish in advanced electronic packages
5. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys
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2. The effects of Cu and Al on dry sliding wear properties of eutectic Sn-9Zn lead-free solder alloy;Journal of Adhesion Science and Technology;2016-03-18
3. Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder;Journal of Alloys and Compounds;2015-06
4. Liquidus Projection and Isothermal Section of the Ag-In-Zn Ternary System;Journal of Electronic Materials;2015-02-18
5. Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys;Journal of Alloys and Compounds;2014-01
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