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Compressive thermal stress and microstructure-driven charge carrier transport in silicon oxycarbide thin films

  • Published:2021-10 Issue:13 Volume:41 Page:6377-6384
  • ISSN:0955-2219
  • Container-title:Journal of the European Ceramic Society
  • language:en
  • Short-container-title:Journal of the European Ceramic Society

Author:

Ricohermoso EmmanuelORCID,Klug Florian,Schlaak Helmut,Riedel RalfORCID,Ionescu EmanuelORCID

Funder

Deutsche Forschungsgemeinschaft

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference62 articles.

1. (Invited) thin film technologies for Micro/Nano systems; a review;van Zeijl;ECS Trans.,2014

2. Piezoelectric Material From Bulk to Thin Film – Comparison,2019

3. Piezoelectric Devices: From Bulk to Thin-Film,2019

4. Polymer-Derived Ceramics: 40 Years of Research and Innovation in Advanced Ceramics;Colombo;J. Am. Ceram. Soc.,2010

5. Polymer derived silicon oxycarbide-based coatings;Lu;Int. Mater. Rev.,2018

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