AlN/Cu composite ceramic substrate fabricated using a novel TiN/AgCuTi composite brazing alloy

Author:

Lv Jinling,Huang Yilian,Fu RenliORCID,Ji Yanru,Wu Binyong,Liu XuhaiORCID

Funder

Department of Education’s Production-Study-Research combined innovation Funding

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference33 articles.

1. Thermal management on IGBT power electronic devices and modules;Qian;IEEE Access,2018

2. Comparative studies on microstructures strengths and reliabilities of two types of AlN direct bonding copper substrates;Wei;Ceram. Int.,2018

3. Recent developments of direct bonded copper (DBC) substrates for power modules;Schulz-Harder;Fifth International Conference on Electronic Packaging Technology Proceedings,2003

4. Transient liquid phase bonding of AlN to AlSiC for durable power electronic packages;Pahinkar;Adv. Eng. Mater.,2018

5. Review of some processes for ceramics to metal joining;Intrater;Mater. Manuf. Process.,1993

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