REVIEW OF SOME PROCESSES FOR CERAMIC‐TO‐METAL JOINING-Reference-Cited by-同舟云学术

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REVIEW OF SOME PROCESSES FOR CERAMIC‐TO‐METAL JOINING

Published:1993-05 Issue:3 Volume:8 Page:353-373
ISSN:1042-6914
Container-title:Materials and Manufacturing Processes
language:en
Short-container-title:Materials and Manufacturing Processes

Author:

Intrater J.

Publisher

Informa UK Limited

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science

Link

http://www.tandfonline.com/doi/pdf/10.1080/10426919308934839

Reference54 articles.

1. Tummala , R.R.Ceramic Packaging; section in Microelectronics Packaging Handbook, Ibid , pp. 495 – 497 .

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