A novel approach to assess the mechanical reliability of thin, ceramic-based multilayer architectures-Reference-Cited by-同舟云学术

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A novel approach to assess the mechanical reliability of thin, ceramic-based multilayer architectures

Published:2020-11 Issue:14 Volume:40 Page:4727-4736
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Gruber M.,Kraleva I.,Supancic P.,Danzer R.,Bermejo R.^ORCID

Funder

Austrian Federal Government

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference36 articles.

1. Multilayered Low Temperature Cofired Ceramics (LTCC) Technology;Imanaka,2005

2. Tape casting of ceramic green tapes for multilayer device processing;Roosen,1999

3. New lamination technique to join ceramic green tapes for the manufacturing of multilayer devices;Roosen;J. Eur. Ceram. Soc.,2001

4. Residual stresses in meta/ceramic bonded strips;Hsueh;J. Am. Ceram. Soc.,1985

5. Ceramics. Mechanical Properties, Failure Behaviour, Materials Selection;Munz,1999

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4. Effects of viscosity and wettability of Pb-B-Si-O glass in silver paste on the co-firing densification of LTCC;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

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