Mechanical and heat transfer properties of AlN/Cu joints based on nanosecond laser-induced metallization-Reference-Cited by-同舟云学术

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Mechanical and heat transfer properties of AlN/Cu joints based on nanosecond laser-induced metallization

Published:2023-05 Issue:5 Volume:43 Page:1897-1903
ISSN:0955-2219
Container-title:Journal of the European Ceramic Society
language:en
Short-container-title:Journal of the European Ceramic Society

Author:

Liu Duo,Chen Naibin,Song Yanyu,Song Xiaoguo,Sun Jie,Tan Caiwang,Long Weimin,Zhong Sujuan,Jia Lianhui

Funder

Taishan Scholar Foundation of Shandong Province

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Materials Chemistry,Ceramics and Composites

Reference36 articles.

1. Thermal management on IGBT power electronic devices and modules;Qian;IEEE Access,2018

2. Development of a ceramic-based composite for direct bonded copper substrate;Akhtar;Ceram. Int.,2017

3. Transient liquid phase bonding of AlN to AlSiC for durable power electronic packages;Pahinkar;Adv. Eng. Mater.,2018

4. Studies on the Al2OC mesophase in synthesized AlN powder and its effects on properties of AlN ceramic substrates;Wei;Ceram. Int.,2020

5. Measurement of heat dissipation and thermal-stability of power modules on DBC substrates with various ceramics by SiC micro-heater chip system and Ag sinter joining;Kim;Micromachines,2019

Cited by 10 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and mechanical properties of AlN and Cu joint using SnAgTi solder metal;Journal of Materials Science: Materials in Electronics;2024-08

2. Fabrication of AlN/Cu composite structure via laser surface metallization assisted direct bonding technology;Journal of Manufacturing Processes;2024-06

3. Precise Analysis of the Differences in the Laser-Activated Energy Density of Aluminum Nitride Ceramics under Various Gas Bath Environments;Coatings;2024-05-15

4. Aluminum nitride‐based ceramics with excellent thermal shock resistances;Journal of the American Ceramic Society;2024-04-05

5. Interface stress analysis and bonding strengthening exploration of metal layer on the laser-activated copper-clad AlN;Microelectronics Reliability;2024-04

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