Author:
Li Hong Wei,Zhao Yi Peng,Chen Guo Qing,Li Ming Hao,Wei Zhi Fan,Fu Xue Song,Zhou Wen Long
Funder
National Natural Science Foundation of China
Fundamental Research Funds for the Central Universities
Subject
Materials Chemistry,Ceramics and Composites
Reference41 articles.
1. Microstructural design of sliding-wear-resistant liquid-phase-sintered SiC: an overview;Borrero-López;J. Eur. Ceram. Soc.,2007
2. Janney, A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices, Mechanical properties and oxidation behavior of a hot-pressed SiC-15-vol%-TiB/sub 2/ composite, Adv. Exe & Sp. Phy. 19 (1987) 322–324. 10.1007/s11663–010-9365–5.
3. A review on die attach materials for SiC-based high-temperature power devices;Chin;Metall. Mater. Trans. B.,2010
4. Status of silicon carbide (SiC) as a wide-bandgap semiconductor for high-temperature applications: a review;Casady;Solid-State Electron,1996
5. Highly electrically and thermally conductive silicon carbide-graphene composites with yttria and scandia additives;Ondrej;J. Eur. Ceram. Soc.,2020
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献