Applications of ESCA to fabrication problems in the semiconductor industry
Author:
Publisher
Elsevier BV
Subject
General Engineering
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1. Characterization and reliability of Ti/Ni/Au, Ti/Ni/Ag and Ti/Ni back-side metallizations in the die-bonding of power electronic devices;Surface and Interface Analysis;1994-07
2. Breakdown voltage and surface compositon in a lead borosilicate glass;Surface and Interface Analysis;1987-09
3. Ni surface chemistry and quality of the Al/Ni bond in electronic devices;Surface and Interface Analysis;1987-07
4. Esca and Sims Study of the Tetrabromobisphenol A Flame Retardant Diffusion to the Metal-Encapsulating Resin Interface;MRS Proceedings;1987
5. Influence of surface chemical composition on the reliability of Al/Cu bond in electronic devices;Applied Surface Science;1986-02
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