Ion implantation for nucleation of electroless Ni films on <100> Si-Reference-Cited by-同舟云学术

Ion implantation for nucleation of electroless Ni films on <100> Si

Published:1997-07 Issue:1-3 Volume:62 Page:705-710
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Bhansali S.,Sood D.K.,Evans P.J.,Brown I.G.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Electroless Plating: Fundamentals and Applications;Mallory,1990

2. Growth structure and electrical characteristic of epitaxial nickel silicide from chemically electroless Ni deposition on Si;Chang;J. Mater. Sci.,1990

3. Electroless plating of metals for micromechanical structures;Furukawa,1993

4. The nucleation, growth, and structure of electroless copper deposits;Sard;J. Electrochem. Soc.,1970

5. Selective electroless copper plating on silicon seeded by copper ion implantation;Bhansali;Thin Solid Films,1994

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1. Low temperature direct electroless nickel plating on silicon wafer;Journal of the Chinese Institute of Engineers;2009-01

2. Electroless Ni–P Deposition on AZ91 D Magnesium Alloy Prepared by Molybdate Chemical Conversion Coatings;Journal of The Electrochemical Society;2009

3. Direct electroless nickel plating on silicon surface;Chinese Science Bulletin;2004-11

4. Direct electroless nickel plating on silicon surface;Chinese Science Bulletin;2004

5. Electron microscopy studies of ion implanted silicon for seeding electroless copper films;Journal of Applied Physics;1998-06