Low-cost HARMS process

Author:

Bischofberger Roger,Zimmermann Heinrich,Staufert Gerhard

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference5 articles.

1. W. Menz and P. Bley, Mikrosystemtechnik for Ingenieure, VCH, Weinheira, ISBN 3-527-29003-6.

2. High aspect ratio electroplated microstructure: using a photosensitive polyimide process;Frazier;Micro Electro Mechanical Systems '92, Travemu¨nde, Germany,1992

3. Low-cost technology for multilayer electroplated parts using laminated dry film resist;Lorenz;Sensors and Actuators A,1996

4. Electrodeposition of 3D microstructures on silicon;Gobet;Micromechanics Europe MME '93, Neuchatel, Switzerland,1993

5. Metrohm, CH-9101 Herisau, Information No. 2/95, pp. 6–12.

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4. MEMS Lithography;Handbook of Silicon Based MEMS Materials and Technologies;2015

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