High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through-Reference-Cited by-同舟云学术

High-resolution shadow-mask patterning in deep holes and its application to an electrical wafer feed-through

Published:1996-06 Issue:1-3 Volume:54 Page:669-673
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Burger G.J,Smulders E.J.T,Berenschot J.W,Lammerink T.S.J,Fluitman J.H.J,Imai S

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference6 articles.

1. Generation of patterns in thin films;Glang,1970

2. Production of fine patterns by evaporation;Gray;RCA Review,1959

3. The black silicon method: a universal method for determining the parameter setting of a fluorine-based reactive ion etcher in deep silicon trench etching with profile control;Jansen,1994

4. Micromachining for packaged sensors;Esashi,1993

5. Fabrication technology for wafer through-hole interconnections and three-dimensional stacks of chips and wafers;Linder,1994

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