Simulation of thermally induced package effects with regard to piezoresistive pressure sensors-Reference-Cited by-同舟云学术

Simulation of thermally induced package effects with regard to piezoresistive pressure sensors

Published:1997-05 Issue:1-3 Volume:60 Page:37-39
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Schilling Frank,Langheinrich Werner,Weiblen Kurt,Arand Dieter

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference6 articles.

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5. Simulative Nachbildung von Temperatureinfluessen auf die elektrischen Eigenschaften gehaeusemontierter Drucksensoren;Schilling,1996

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