Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies-Reference-Cited by-同舟云学术

Packaging effect investigation of CMOS compatible pressure sensor using flip chip and flex circuit board technologies

Published:2006-01 Issue:1 Volume:126 Page:48-55
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Lee Chang-Chun,Peng Chih-Tang,Chiang Kuo-Ning

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference10 articles.

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4. Measurement of the temperature dependency of the piezoresistance coefficients in p-type silicon;Lund;Adv. Electron. Pack. -ASME,1999

5. A piezoresistive sensor chip for measurement of stress in electronic packaging;Jaeger,1993

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