A bulk-micromachined three-axis accelerometer using silicon direct bonding technology and polysilicon layer-Reference-Cited by-同舟云学术

A bulk-micromachined three-axis accelerometer using silicon direct bonding technology and polysilicon layer

Published:1998-04 Issue:1-3 Volume:66 Page:250-255
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Kwon Kijin,Park Sekwang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Tri-axial piezoelectric accelerometer;Okada,1995

2. A study of three dimensional polysilicon type accelerometer using silicon direct bonding technology;Kwon,1996

3. Three-axis capacitive accelerometer with uniform axial sensitivities;Mineta,1995

4. Capacitive type 3-axis accelerometer;Torayashiki,1996

5. Application of an electronic accelerometer for a single point sensing airbag electronic control unit;Hartl,1991

Cited by 44 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Design and Characterization of CMOS Micromachined Piezoresistive Accelerometers;IEEE Sensors Journal;2024-02-01

2. High-G MEMS Accelerometer With Cross-Symmetric Structures;IEEE Sensors Journal;2024-01-15

3. Maskless lithography: an approach to SU-8 based sensitive and high-g Z-axis polymer MEMS accelerometer;Microsystem Technologies;2021-04-29

4. Study on the cleaning process of n+-poly-Si wraparound removal of TOPCon solar cells;Solar Energy;2020-11

5. Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique;JOURNAL OF SENSOR SCIENCE AND TECHNOLOGY;2020-09-30