Author:
Butler Jeffrey T.,Bright Victor M.,Comtois John H.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference13 articles.
1. Packaging technologies for space-based microsystems and their elements;Lyke,1995
2. New multichip-on-silicon packaging scheme for microsystems;Guerin;Sensors and Actuators A,1996
3. Optoelectronic multichip modules for high-speed computer systems and communication networks;Koh;Opt. Eng.,1997
4. Multi-User MEMS Processes (MUMPS) Introduction and Design Rules;Koester,1996
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献