Low-temperature anodic bonding to silicon nitride-Reference-Cited by-同舟云学术

Low-temperature anodic bonding to silicon nitride

Published:2000-05 Issue:1-3 Volume:82 Page:249-253
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Weichel S,de Reus R,Bouaidat S,Rasmussen P.A,Hansen O,Birkelund K,Dirac H

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Silicon-to-thin film anodic bonding;Hanneborg;J. Micromech. Microeng.,1992

2. New applications of r.f.-sputtered glass films as protection and bonding layers in silicon micromachining;Berenschot;Sens. Actuators, A,1994

3. Silicon-to-silicon wafer bonding using evaporated glass;Weichel;Sens. Actuators, A,1998

4. Anodic bonding technique under low temperatures and low voltage using evaporated glass;Choi;J. Vac. Sci. Technol., B,1997

5. Silicon to silicon anodic bonding using evaporated glass;Krause,1995

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