A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching-Reference-Cited by-同舟云学术

A bulk micromachined vibratory lateral gyroscope fabricated with wafer bonding and deep trench etching

Published:2000-05 Issue:1-3 Volume:83 Page:24-29
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Li Zhihong,Yang Zhenchuan,Xiao Zhixiong,Hao Yilong,Li Ting,Wu Guoying,Wang Yangyuan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. A Study of silicon angular rate sensors using anisotropic etching technology;Maenaka;Sens. Actuators, A,1994

2. Silicon resonant angular rate sensor using electromagnetic excitation and capacitive detection;Hashimoto;J. Micromech. Microeng.,1995

3. A precision yaw rate sensor in silicon micromachining;Lutz,1997

4. Analysis of highly sensitive silicon gyroscope with cantilever beam as vibrating mass;Maenaka;Sens. Actuators, A,1996

5. Surface micromachined z-axis vibratory rate gyroscope;Clark,1996

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