Author:
Lee Chengkuo,Huang Wei-Feng,Shie Jin-Shown
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. Silicon wafer bonding: key to MEMS high-volume manufacturing;Mirza;Sensors,1998
2. Wafer-to-wafer bonding for microstructure formation;Schmidt;Proc. IEEE,1998
3. Low-temperature anodic bonding using lithium aluminosilicate — quartz glass ceramic;Shoji;Sens. Actuators, A,1998
4. Low-temperature intermediate Au–Si wafer bonding; eutectic or silicide bond;Wolffenbuttel;Sens. Actuators, A,1997
5. Low-temperture packaging of CMOS infrared microsystems by Si–Al–Au bonding;Waelti;Proc. Electrochem. Soc. (Paris),1998
Cited by
45 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献