Low-cost post-CMOS integration of electroplated microstructures for inertial sensing-Reference-Cited by-同舟云学术

Low-cost post-CMOS integration of electroplated microstructures for inertial sensing

Published:2000-05 Issue:1-3 Volume:83 Page:93-100
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Wycisk M.,Tönnesen T.,Binder J.,Michaelis S.,Timme H.-J.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Simulation, design and fabrication of electroplated acceleration switches;Tönnesen;J. Micromech. Microeng.,1997

2. Analog Devices, Monolithic accelerometer with signal conditioning ADXL50, Application Notes, 1995.

3. MEMS acceleration threshold switches fabricated with a low-cost, post-CMOS additive electroplating process;Michaelis,1999

4. Dry release of metal structures in oxygen plasma: process characterization and optimization;Bartek;J. Micromech. Microeng.,1998

5. Characterization of anhydrous HF gas-phase etching with CH3OH for sacrificial oxide removal;Lee;Sensors and Actuators A,1998

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