Integrated vector sensor and magnetic compass using a novel 3D Hall structure-Reference-Cited by-同舟云学术

Integrated vector sensor and magnetic compass using a novel 3D Hall structure

Published:2001-08 Issue:1-3 Volume:92 Page:119-122
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Roumenin Ch.,Dimitrov K.,Ivanov A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference16 articles.

1. Ch. Roumenin, Solid State Magnetic Sensors, Elsevier, Amsterdam, 1994.

2. Magnetic sensors continue to advance towards perfection (invited paper);Roumenin;Sens. Actuators,1995

3. Future of IC microtransducers;Baltes;Sens. Actuators,1996

4. A. Haberli, M. Schneider, P. Malcovati, R. Castagneti, F. Maloberti, H. Baltes, 2D magnetic microsensor with on-chip signal processing for contactless angle measurement, in: Proceedings of the IEEE International Solid State Circuit Conference on Technichal Digest., ISSCC, San Francisco, CA, USA, 1996, pp. 332–333.

5. Application of multidimensional magnetic sensors — position and movement detection;Maenaka;Sens. Mater.,1996

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