Author:
Itoh Toshihiro,Kataoka Kenichi,Suga Tadatomo
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference7 articles.
1. Ya. Zhang, Yo. Zhang, D. Worsham, D. Morrow, R.B. Marcus, A new MEMS wafer probe card, in: Proceedings of 10th International Workshop on Micro Electro Mechanical Systems (MEMS’97), Nagoya, Japan, 26–30 January 1997, pp. 395–399.
2. Thermally actuated microprobes for a new wafer probe card;Zhang;J. Microelectromech. Syst.,1999
3. T. Itoh, T. Suga, G. Engelmann, J. Wolf, O. Ehrmann, H. Reichl, Applicability of MEMS probe card to wafer-level test, in: Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference (InterPACK’99), Maui, Hawaii, USA, 13–19 June 1999, pp. 123–130.
4. R. Holm, Electric Contacts—Theory and Application, 4th Edition, Springer, Berlin, 1967, pp. 135–152.
5. M. Beiley, J. Leung, S.S. Wong, A micromachined array probe card-characterization, IEEE Trans. Components Packaging Manuf. Technol. (CPMT) B 18 (1995) 184–191.
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