Reliability design and assessment of a micro-probe using the results of a tensile test of a beryllium–copper alloy thin film
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference12 articles.
1. MEMS spring probe for non-destructive wafer level chip test
2. Fabrication of micro IC probe for LSI testing
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