Conformal coatings for 3D multichip microsystem encapsulation

Author:

Janting Jakob,Branebjerg Jens,Rombach Pirmin

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. J. Noordegraaf, H. Hull, C-SHIELD Parylene allows major weight saving for EM shielding of microelectronics, PEP’97, in: Proceedings of the first IEEE International Symposium on Polymeric Electronics Packaging, pp. 189–196.

2. J. Wu, R.T. Pike, C.P. Wong, Interface–adhesion–enhanced bi-layer conformal coating for avionics application, in: Proceedings of the IEEE 1999 International Symposium on Advanced Packaging Materials, pp. 302–310.

3. Thin polyaniline films in EMI shielding;Mäkelä;Synth. Met.,1997

4. S. Pienimaa, T. Taka, H. Isotalo, S. Jussila, O. Salmela, H. Stubb, Method and arrangement for electromagnetically shielding and electronic means, European patent application EPA1781085.

5. L.M. Higgins, Shielded Electronic Component Assembly and Method for Making the Same, US Patent no. 5639989.

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