SILC in MOS capacitors with poly-Si and poly-Si0.7Ge0.3 gate material

Author:

Houtsma V.E.,Holleman J.,Salm C.,Woerlee P.H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. A new quantitative model to predict SILC-related disturb characteristics in Flash E2PROM devices;De Blauwe,1996

2. Mechanism for stress-induced leakage currents in thin silicon dioxide films;DiMaria;J. Appl. Phys.,1995

3. Gate Current and Oxide Reliability in p+ Poly MOS Capacitors with Poly-Si and Poly-Ge0.3Si0.7 Gate Material;Salm;Electron Dev. Lett.,1998

4. On the Polarity Dependence of Oxide Breakdown in MOS-Devices with n+ and p+ Polysilicon Gate;Ogier,1996

5. V.E. Houtsma et al. “Stress-Induced Leakage Current in p+ Poly MOS Capacitors with Poly-Si and Poly-Si0.7Ge0.3 Gate Material”, accepted for publication in Electron Dev. Lett.

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