Fast and accurate analysis of the multiconductor interconnects-Reference-Cited by-同舟云学术

Fast and accurate analysis of the multiconductor interconnects

Published:2001-03 Issue:1-4 Volume:55 Page:37-42
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Ymeri H.,Nauwelaers B.,Maex K.,De Roest D.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Multiconductor transmission lines in multilayered dielectric media;Wei;IEEE Trans. Microwave Theory Tech.,1984

2. Efficient capacitance calculations for three-dimensional multiconductor systems;Ruehli;IEEE Trans. Microwave Theory Tech.,1973

3. Fast parameter extraction for multiconductor interconnects in multilayered dielectric media using mixture method of equivalent source and measured equation of invariance;Jin;IEEE Trans. Components Packaging Manufacturing Technol.,1997

4. New finite element techniques for skin effect problems;Konrad;IEEE Trans. Magnetics,1982

5. Space-domain Green’s function approach to the capacitance calculation of multiconductor lines in multilayered dielectrics with improved surface charge modelling;Delbare;IEEE Trans. Microwave Theory Tech.,1989

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1. On the frequency-dependent line admittance of VLSI interconnect lines on silicon-based semiconductor substrates;Microelectronics Journal;2002-05

2. On the frequency‐dependent line capacitance and conductance of on‐chip interconnects on lossy silicon substrate;Microelectronics International;2002-04-01

3. On the modelling of multiconductor multilayer systems for interconnect applications;Microelectronics Journal;2001-04

4. On the capacitance and conductance calculations of integrated-circuit interconnects with thick conductors;Microwave and Optical Technology Letters;2001

5. Simple and efficient approach for shunt admittance parameters calculations of VLSI on-chip interconnects on semiconducting substrate;Proceedings 2002 Design, Automation and Test in Europe Conference and Exhibition