Electrochemical mechanical deposition (ECMD) technique for semiconductor interconnect applications-Reference-Cited by-同舟云学术

Electrochemical mechanical deposition (ECMD) technique for semiconductor interconnect applications

Published:2002-10 Issue:1-4 Volume:64 Page:43-51
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Başol B.M,Uzoh C.E,Talieh H,Young D,Lindquist P,Wang T,Cornejo M

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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2. K. Wong, S. Kaja, P. DeHaven, IBM J. Res. Dev. (1998) 42–45.

3. D. Edelstein, J. Heidenreich, R. Goldblatt, W. Cote, C. Uzoh, N. Lustig, P. Roper, T. McDevitt, W. Motsiff, A. Simon, J. Dukovic, R. Wachnik, H. Rathore, R. Schulz, L. Su, S. Luce, J. Slattery, Proc. IEDM 97, IEEE (1997) 773.

4. J. Reid, S. Mayer, E. Broadbent, E. Klawuhn, K. Ashtiani, Factors Influencing Damascene Feature Fill Using Copper PVD and Electroplating, Solid State Technology, July 2000.

5. H. Talieh, Method and Apparatus for Electrochemical Mechanical Deposition, U.S. Patent 6,176,992 B1, January 23, 2001.

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