Author:
Seo Yong-Jin,Kim Sang-Yong,Lee Woo-Sun
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference8 articles.
1. Planarizing interlevel dielectrics by chemical mechanical polishing;Bath;Solid State Tech.,1992
2. Correlation analysis between pattern and non-pattern wafer for characteristics of shallow trench isolation–chemical mechanical polishing process;Kim;Microelectron. Eng.,2002
3. Investigation of CMP micro-scratch in the fabrication of sub-quarter micron VLSI circuit;Huang,1999
4. Improved STI CMP technology for micro-scratch issue;Lin,1999
5. Filtration of CMP slurries in chemical delivery systems;Lin,1997
Cited by
19 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献