Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material-Reference-Cited by-同舟云学术

Benzocyclobutene (DVS-BCB) polymer as an interlayer dielectric (ILD) material

Published:1997-01 Issue:1-4 Volume:33 Page:327-334
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Mills Michael E.,Townsend Paul,Castillo Dan,Martin Steve,Achen Albert

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference14 articles.

1. Benzocyclobutenes in polymer synthesis;Kirchhoff;Prog. Polym. Sci.,1993

2. Cu/photosensitive BCB thin film multilayer technology for high performance multichip modules;Shimoto,1994

3. High frequency transmission properties of Al-BCB Si multichip modules;Hesselborm,1992

4. Manufacturing studies of BCB as the interlevel dielectric material for multilevel interconnect multichip modules and VLSI applications;Sherrima,1992

5. High speed interconnect for GaAs: Triquint QLSI2 technology;Finchem,1996

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