Estimation of steady-state temperature field in Multichip Modules using deep convolutional neural network

Author:

Hua Yue,Wang Zhi-Qiao,Yuan Xin-Yi,Bai Li Yu,Wu Wei-Tao,Aubry Nadine

Funder

Natural Science Foundation of Jiangsu Province

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes

Reference37 articles.

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3. Numerical simulation of heat sink cooling in the mainboard chip of a computer with temperature dependent thermal conductivity;Zaretabar;Appl. Therm. Eng.,2018

4. Optimization of the thermal distribution of multi-chip LED package;Ben Abdelmlek;Appl. Therm. Eng.,2017

5. Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits;Wang;Appl. Therm. Eng.,2021

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