Author:
Singh Bineeta,Kumar Pradeep
Funder
Department of Chemical Engineering, IIT (BHU) Varanasi, India
Subject
Fluid Flow and Transfer Processes
Reference38 articles.
1. L.T. Yeh, Review of Heat Transfer Technologies in Electronic Equipment, J. Electronic Packag. 117 (1995) 333–339. DOI: 10.1115/1.2792113.
2. J.W. Knoll, The new trend in minified communications equipment, IRE Trans. Vehicular Commun. VC-9 (1960) 25–32. DOI: 10.1109/TVC.1960.6499328.
3. S. Wang, H. Gao, Z. Wang, The research of parameter optimization design method for analogy circuit [analog circuits], in: Proceedings of the 21st IEEE Instrumentation and Measurement Technology Conference (IEEE Cat. No.04CH37510), 2004, pp. 1515-1518 Vol.1512.
4. Integrated thermal management techniques for high power electronic devices;McGlen;Appl. Therm. Eng.,2004
5. W. Qu, I. Mudawar, Analysis of three-dimensional heat transfer in micro-channel heat sinks, Int. J. Heat Mass Transfer. 45 (2002) 3973–3985. https://doi.org/10.1016/S0017-9310(02)00101-1.
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