1. Motion sensors de-mystified;Becky;EDN Network,2010
2. CMOS–MEMS integration today and tomorrow;Witvrouw;Scripta Materialia,2008
3. Poly-SiGe-Based MEMS Thin-Film Encapsulation;Guo;J. Microelectromech. Syst.,2012
4. P. Helin, A. Verbist, J. De Coster, B. Guo, S. Severi, A. Witvrouw, et al., “A wafer-level poly-SiGe-based thin film packaging technology demonstrated on a SOI-based high-Q MEM resonator”, proc. Transducers’11, Beijing (China), June 5–9 (2011) pp. 982–985.
5. Packaging;Tilmans,2010