Detection of micro solder balls using active thermography and probabilistic neural network-Reference-Cited by-同舟云学术

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Detection of micro solder balls using active thermography and probabilistic neural network

Published:2017-03 Issue: Volume:81 Page:236-241
ISSN:1350-4495
Container-title:Infrared Physics & Technology
language:en
Short-container-title:Infrared Physics & Technology

Author:

He Zhenzhi,Wei Li,Shao Minghui,Lu Xingning

Funder

National Natural Science Foundation of China

Open foundation of State Key Lab of Digital Manufacturing Equipment & Technology

Publisher

Elsevier BV

Subject

Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference15 articles.

1. Electronic Failure Analysis Handbook;Martin,1999

2. Defect detection of flip chip solder bumps with wavelet analysis of laser ultrasound signals;Yang;IEEE Trans. Adv. Packag.,2010

3. R. Asgari, Challenges in 3D inspection of micro bumps used in 3D packaging, in: Proceedings of 45th International Symposium on Microelectronics, San Diego, 2012, pp. 542–547.

4. Materials Characterization: Introduction to Microscopic and Spectroscopic Methods;Leng,2008

5. The development of automated solder bump inspection using machine vision techniques;Wu;Int. J. Adv. Manuf. Technol.,2013

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