Device-level vacuum packaged uncooled microbolometer on a polyimide substrate

Author:

Ahmed Moinuddin,Butler Donald P.,Celik-Butler Zeynep

Funder

National Science Foundation

Publisher

Elsevier BV

Subject

Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference20 articles.

1. A device level vacuum packaging scheme for microbolometers on rigid and flexible substrate;Mahmood;IEEE Sens. J.,2007

2. Device-level vacuum packaged MEMS resonator;Shahriar Rahman;IEEE/ASME J. Microelectromech. Syst.,2010

3. Infrared detector: an overview;Rogalski;Infrared Phys. Technol.,2002

4. High responsivity a-SixGe1xOy: H microbolometers;Rana;IEEE Sens. J.,2007

5. An overview of uncooled infrared sensors technology based on amorphous silicon and silicon germanium alloys;Ambrosio;Phys. Status Solidi C,2010

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1. High-Responsivity Vacuumless Microbolometer Arrays Microfabricated on Thermally Isolated Suspended Membranes;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21

2. Introduction;Microbolometers;2022

3. Types of microbolometers;Microbolometers;2022

4. Self-Packaged, Flexible, Bendable MEMS Sensors and Energy Harvesters;IEEE Sensors Journal;2021-06-01

5. Fabrication of Microbolometer Arrays Based on Polymorphous Silicon–Germanium;Sensors;2020-05-09

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