Device-Level Vacuum Packaging for RF MEMS-Reference-Cited by-同舟云学术

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Device-Level Vacuum Packaging for RF MEMS

Published:2010-08 Issue:4 Volume:19 Page:911-918
ISSN:1057-7157
Container-title:Journal of Microelectromechanical Systems
language:
Short-container-title:J. Microelectromech. Syst.

Author:

Shahriar Rahman M.,Chitteboyina Murali M.,Butler Donald P.,Celik-Butler Zeynep,Pacheco Sergio P.,McBean Ronald V.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Mechanical Engineering

Link

http://xplorestaging.ieee.org/ielx5/84/5532211/05508328.pdf?arnumber=5508328

Cited by 19 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Self-Packaged, Flexible, Bendable MEMS Sensors and Energy Harvesters;IEEE Sensors Journal;2021-06-01

2. CMOS Compatible Hermetic Packages Based on Localized Fusion Bonding of Fused Silica;Journal of Microelectromechanical Systems;2019-08

3. Au maskless patterning for vacuum packaging using the electrochemical method;Nanotechnology and Precision Engineering;2018-09

4. Wafer-Level Vacuum-Packaged Flexible and Bendable Micro Accelerometer;IEEE Sensors Journal;2018-05-15

5. Wafer-level vacuum package of two-dimensional micro-scanner;Microsystem Technologies;2017-12-15

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