Experimental investigation on two-phase two-component jet impingement heat transfer from simulated microelectronic heat sources-Reference-Cited by-同舟云学术

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Experimental investigation on two-phase two-component jet impingement heat transfer from simulated microelectronic heat sources

Published:1990-07 Issue:4 Volume:17 Page:399-408
ISSN:0735-1933
Container-title:International Communications in Heat and Mass Transfer
language:en
Short-container-title:International Communications in Heat and Mass Transfer

Author:

Ma C.F.,Tian Y.Q.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Chemical Engineering,Atomic and Molecular Physics, and Optics

Reference15 articles.

1. Cooling Electronic Equipment: Past, Present, and Future;Nakayama,1983

2. Liquid Immersion Cooling of Electronic Components;Incropera,1983

3. Boiling Jet Impingement Cooling of Simulated Microelectronic Chips;Ma;Heat Transfer in Electronic Equipment---1983, ASME HTD--Vol. 28,1983

4. Jet Impingement Nucleate Boiling;Ma;Int. J. Heat Mass Transfer,1986

5. Experimental Investigation of Single Phase Multi-Jet Impingement Cooling of Array of Microelectronic Heat Sources;Jiji,1987

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