Sound insulation properties of sandwich structure with hemispheric shell cores: Numerical and experimental studies
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Acoustics and Ultrasonics
Reference35 articles.
1. Sound absorption structures: From porous media to acoustic metamaterials;Yang;Annu Rev Mater Res,2017
2. Dynamic response of sandwich panel with hierarchical honeycomb cores subject to blast loading;Sun;Thin-Walled Struct,2019
3. Mechanical response of carbon/epoxy composite sandwich structures with three-dimensional corrugated cores;Xu;Compos Sci Technol,2018
4. Numerical modeling of the geometrical defects of an origami-like sandwich core;Baranger;Compos Struct,2011
5. The mechanical compression performance of ultra-fine grained stainless steel pyramidal lattice core;Kuleyin;Mech Adv Mater Struct,2019
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