Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications-Reference-Cited by-同舟云学术

Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications

Published:2022-12 Issue: Volume:262 Page:125440
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Liu Li^ORCID,Li Ying,Yu Xianglei,Du Jinghong^ORCID,Zhang Jiamin,Li Junpeng,Gan Guoyou^ORCID

Funder

National Natural Science Foundation of China

Applied Basic Research Foundation of Yunnan Province

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference55 articles.

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3. Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application;An;Chem. Eng. J.,2022

4. Recent progress on thermal conductive and electrical insulating polymer composites;Zhang;Compos. Commun.,2018

5. Thermal conductivity of polymers and their nanocomposites;Xu;Adv. Mater.,2018

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