Method of scale bridging for thermoelasticity of cross-linked epoxy/SiC nanocomposites at a wide range of temperatures-Reference-Cited by-同舟云学术

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Method of scale bridging for thermoelasticity of cross-linked epoxy/SiC nanocomposites at a wide range of temperatures

Published:2012-10 Issue:22 Volume:53 Page:5178-5189
ISSN:0032-3861
Container-title:Polymer
language:en
Short-container-title:Polymer

Author:

Choi Joonmyung,Yang Seunghwa,Yu Suyoung,Shin Hyunseong,Cho Maenghyo

Funder

Ministry of Education, Science and Technology

Publisher

Elsevier BV

Subject

Polymers and Plastics,Materials Chemistry,Organic Chemistry

Reference23 articles.

1. Interface reaction between Ag-Pd conductor and Pd-Sn solder

2. Effect of underfill filler settling on thermo-mechanical fatigue analysis of flip-chip eutectic solders

3. Multi-scale modeling of cross-linked epoxy nanocomposites

4. The glass transition and thermoelastic behavior of epoxy-based nanocomposites: A molecular dynamics study

5. Sequential thermoelastic multiscale analysis of nanoparticulate composites

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2. Accelerating the kinetics of curing reaction of SBR/BR blend by silicon carbide via modification of thermal diffusivity;Materials Today Communications;2023-12

3. Recent studies on the multiscale modeling and simulation of polymer nanocomposites;JMST Advances;2023-09

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5. Classical, Coarse-Grained, and Reactive Molecular Dynamics Simulations on Polymer Nanocomposites;Multiscale Science and Engineering;2022-09-22

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