Interface reaction between Ag-Pd conductor and Pd-Sn solder-Reference-Cited by-同舟云学术

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Interface reaction between Ag-Pd conductor and Pd-Sn solder

Published:1998-11 Issue:4 Volume:21 Page:394-397
ISSN:1070-9894
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. B

Author:

Moriya Yoichi,Yamade Yoshiaki,Shinya Ryuji

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx5/96/15737/00730423.pdf?arnumber=730423

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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5. Interfacial Reactions of Ag and Ag-4Pd Stud Bumps with Sn-3Ag-0.5Cu Solder for Flip Chip Packaging;Journal of Electronic Materials;2020-10-21

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