A mesoscale study of thermal expansion behaviors of epoxy resin and carbon fiber/epoxy unidirectional composites based on periodic temperature and displacement boundary conditions-Reference-Cited by-同舟云学术

A mesoscale study of thermal expansion behaviors of epoxy resin and carbon fiber/epoxy unidirectional composites based on periodic temperature and displacement boundary conditions

Published:2016-10 Issue: Volume:55 Page:44-60
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Dong Kai,Zhang Jiajin,Cao Miao,Wang Minglin,Gu Bohong,Sun Baozhong

Funder

National Science Foundation of China

Fok Ying Tong Education Foundation

“Shu Guang” project

Shanghai Municipal Education Commission

Shanghai Education Development Foundation

Research Center for Commercial Aircraft Manufacturing

Fundamental Research Funds for the Central Universities of China

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference57 articles.

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4. Characterisation of thermal expansion coefficient of anisotropic materials by electronic speckle pattern interferometry;Dudescu;Strain,2006

5. Measurement of coefficient of thermal expansion of films using digital image correlation method;Pan;Polym. Test.,2009

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